WAFERS and SUBSTRATES

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We supply a wide variety of substrates for the deposition of thin films, whether oriented (single crystals) or not. Such substrates are produced using the most advanced manufacturing techniques, such as the Czochralski, arc melting, blaze, Kyropoulos, float-zone, hydrothermal methods, among others. Depending on the type of material, our team evaluates the most appropriate technique to be used.

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According to our production capacity, we can supply substrates with the following characteristics:

• Shapes: round or rectangular

• Polishing: unpolished, 1 side polished or 2 sides polished

• Surface roughness: minimum 0.5 nm (depends on material)

• Thickness: minimum 300 nm (depends on material)

• Orientation: <001>, <100>, <110>, <111>, <0001> and non-oriented

• Conduction type: P, N, Intrinsic (for semiconductors)

• Resistivity: silicon wafers (0.001-0.005 ohm*cm, 1-10 ohm*cm, > 1000 ohm*cm)

• Miscut angle: as per request

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See below a list of some of the main types of substrates that we can supply (others can be requested):

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LaAlO3       LSAT       SrTiO3 (STO)       MgO       YSZ       KTaO3       SrLaAlO4       YAlO3       MgAl2O4     (LaAlO3)0.3(Sr2AlTaO8)0.7

 

Nb:SrTiO3       Fe:SrTiO3       Nd:SrTiO3       Al2O3       MgAl2O4       GGG (Gd3Ga5O12)       TiO2       TGG       Si       GaAs      LiAlO2

 

MgAl2O4       SiC       ZnO       GaN       Ge       InP       InAs       GaSb       ZnSe       LnNbO3       LiTaO3       SiO2       TeO2       TiO2

 

CaF2       MgF2       BaF2       LiF       Ti:Al2O3       Cr:Al2O3       Nd:YAG       Nd:YVO4       Nd:YLF       Yb:YAP       Cr:YAG       NaCl

 

KCl       KBr       Sapphire       ITO       FTO       K7 and K9 Glasses

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